The application of a uniform magnetic field across (perpendicular) to a stack of wafers provides better yield, quality and operating parameter flexibility to the wafer manufacture. The magnetic field is applied during the annealing process with the wafers residing inside a high temperature vacuum furnace. Fields in the 2 Tesla range are normally used. The limiting factor to field strength is often the size of the oven which must reside inside the bore of the magnet.
Such systems operate in a production environment and therefore cryogen free technology is preferred to avoid the need for routine cryogen handling by production personnel. System reliability, safety and simplified user interface are all key considerations when planning for the design or installation of such systems. Other considerations include ease of access to the oven for loading/unloading, stray field implications or controls.
AMI has the experience to work with semicon furnace manufacturers to provide magnet systems with large uniform fields, fast/reliable cryogen free cooling, robust digitally controlled power supplies and the engineering resources to make your project a success.