The application of a uniform magnetic field across (perpendicular) to a stack of wafers provides
better yield, quality and operating parameter flexibility to the wafer manufacture. The magnetic
field is applied during the annealing process with the wafers residing inside a high temperature
vacuum furnace. Fields in the 2 Tesla range are normally used. The limiting factor to field
strength is often the size of the oven which must reside inside the bore of the magnet.
Such systems operate in a production environment and therefore cryogen free technology is preferred
to avoid the need for routine cryogen handling by production personnel. System reliability, safety
and simplified user interface are all key considerations when planning for the design or installation
of such systems. Other considerations include ease of access to the oven for loading/unloading, stray
field implications or controls.
AMI has the experience to work with semicon furnace manufacturers to provide magnet systems with
large uniform fields, fast/reliable cryogen free cooling, robust digitally controlled power supplies
and the engineering resources to make your project a success.