The application of a uniform  magnetic field across (perpendicular)  to a stack of wafers provides 
                                better yield, quality and operating parameter  flexibility to the wafer manufacture.  The magnetic 
                                field is applied  during the annealing process with the wafers residing inside a high temperature  
                                vacuum furnace. Fields in the 2 Tesla range are normally used.  The  limiting factor to field 
                                strength is often the size of the oven which must  reside inside the bore of the magnet.
                              
                              
                                Such systems operate in a production  environment and therefore cryogen free technology is preferred 
                                to avoid the  need for routine cryogen handling by production personnel. System reliability,  safety 
                                and simplified user interface are all key considerations when planning  for the design or installation 
                                of such systems. Other considerations include  ease of access to the oven for loading/unloading, stray 
                                field implications or controls.
                              
                              
                                AMI has the experience to work with semicon furnace manufacturers to  provide magnet systems with 
                                large uniform fields, fast/reliable cryogen free  cooling, robust digitally controlled power supplies 
                                and the engineering resources to make your project a success.